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Informace o produktu
Přehled produktu
AES-ACC-KRIA-HSINK is an Avnet heat sink for AMD-Xilinx Kria K26 SOM designed specifically for the AMD-Xilinx Kria K26 system on module (SOM). The heat sink mounts directly to the heat spreader plate that comes standard on the K26 SOM. This solution is “turn key” as it includes the mounting hardware as well as the interface “gap” material preinstalled on the heat sink. The Avnet heat sink for Kria K26 is designed to provide passive relief for designs up to 10W in room temperature (approximately 26C) applications. Designed with flexibility in mind, mounting holes in the heat sink allow for the addition of a standard 50x50mm fan. The addition of a fan provides maximum thermal relief capability allowing for higher power and higher ambient temperature operation.
Obsah
Custom aluminium heat sink extrusion designed for the AMD-Xilinx Kria K26 SOM, Preinstalled thermal gap material optimized for heat transfer, 4 mounting screws.
Technické specifikace
Heat Sink
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AMD-Xilinx Kria K26 System-On-Module
No SVHC (27-Jun-2024)
Technické dokumenty (1)
Legislativa a životní prostředí
Country in which last significant manufacturing process was carried outZemě původu:China
Country in which last significant manufacturing process was carried out
RoHS
Osvědčení o shodě