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Informace o produktu
Přehled produktu
Half-bridge evaluation kit for RoadPak IGBT/SiC modules featuring the GD3100. This half-bridge evaluation kit populated with two GD3100 single channel IGBT/SiC MOSFET gate drive devices. The kit includes the Freedom KL25Z microcontroller hardware for interfacing a PC installed with Flex GUI software for communication to the SPI registers on the MC33GD3100 gate drive devices in either daisy chain or standalone configuration. The GD3100 translator board is used to translate 3.3V signals to 5.0V signals between the MCU and MC33GD3100 gate drivers.
- Compatible with RoadPak SiC MOSFET module
- Flex GUI available for use with kit
- Daisy chain SPI interface configurability
- Easy to configure jumper options
- SPI configurable register options using SPIGEN GUI
- Double pulse and short circuit evaluations
- Fibre optic connections for external PWM inputs
Obsah
Assembled and tested FRDMGD31RPEVM board in an anti-static bag, 3.3V to 5V translator board (KITGD3160TREVB) connected to FRDM-KL25Z, USB cable, type A male/type mini B male, 3ft, Quick start guide.
Technické specifikace
NXP
Správa Napájení
Zkuš. Deska GD3100 s FRDM-KL25Z, Deska Překladače 3.3V na 5V, 3ft USB Kabely, Příručka Rychlého Startu
No SVHC (27-Jun-2024)
GD3100
IGBT Hradlový Budič
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Technické dokumenty (1)
Související produkty
Nalezené produkty: 2
Legislativa a životní prostředí
Country in which last significant manufacturing process was carried outZemě původu:United States
Country in which last significant manufacturing process was carried out
RoHS
RoHS
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