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Informace o produktu
Přehled produktu
XC7K325T-1FBG900I is a Kintex®-7 FPGA IC. It addresses the complete range of system requirements, ranging from low-cost, small form factor, cost-sensitive, high-volume applications to ultra-high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. It is optimized for best price-performance with a 2X improvement compared to the previous generation, enabling a new class of FPGAs.
- 36KB dual-port block RAM with built-in FIFO logic for on-chip data buffering
- Integrated block for PCI Express® (PCIe), for up to x8 Gen3 endpoint and root port designs
- 12.5Gb/s transceiver speed, 800Gb/s serial bandwidth
- x8 Gen2 PCIe interface, 1,866Mb/s memory interface
- 1.2V to 3.3V I/O voltage
- 326,080 logic cells
- 50,950 slices, 4,000KB max distributed RAM configurable logic blocks (CLBs)
- 890 (18KB), 445 (36KB), 16,020 max (KB) block RAM blocks
- FCBGA900 package
- Industrial temperature range from -40°C to +100°C
Výstrahy
Warranty Information: Xilinx semiconductor products have a warranty of twelve (12) months from date of purchase. Market demand for this product has caused an extension in leadtimes. Delivery dates may fluctuate. Product exempt from discounts.
Poznámky
Please note this product is Non-Cancellable and Non-Returnable (NCNR). Warranty Information: Xilinx semiconductor products have a warranty of twelve (12) months from date of purchase.
Technické specifikace
-
FCBGA
1
28nm (HKMG)
-40°C
Kintex-7 XC7K325T
-
MMCM, PLL
970mV
3.3V
350I/O
326080Macrocells
625MHz
326080Logic Cells
900Pinů
350I/O
Povrchová Montáž
100°C
-
No SVHC (15-Jan-2018)
1.03V
Kintex-7
FCBGA
326080
1
16020Kbit
Technické dokumenty (1)
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Legislativa a životní prostředí
Country in which last significant manufacturing process was carried outZemě původu:Taiwan
Country in which last significant manufacturing process was carried out
RoHS
RoHS
Osvědčení o shodě