BGA-STD-015
Chladič, Pro Ball Grid Array, Standardní, 26.5 °C/W, BGA, 14 mm, 10 mm, 14 mm
2 500 Nyní si můžete rezervovat zásoby na skladě
| Množství | |
|---|---|
| 1+ | 74.488 Kč |
| 10+ | 56.681 Kč |
| 25+ | 45.646 Kč |
| 50+ | 42.887 Kč |
| 100+ | 42.134 Kč |
Informace o produktu
Přehled produktu
The BGA-STD-015 is a 14mm standard Heat Sink with aluminium, black anodized, thermal tape, 26.5°C/W thermal resistance. This heat sink features excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated, on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.
- 0.27mm Thickness
Technické specifikace
26.5°C/W
14mm
14mm
Hliník
0.39"
-
BGA
10mm
-
0.55"
0.55"
-
Technické dokumenty (1)
Související produkty
Nalezené produkty: 5
Legislativa a životní prostředí
Country in which last significant manufacturing process was carried outZemě původu:Great Britain
Country in which last significant manufacturing process was carried out
RoHS
RoHS
Osvědčení o shodě