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Photomultiplier 4x4 3mm Sensor Array , For Use with On Semiconductor ARRAYJ-BOB3-16P Breakout Boards

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J-Series SiPM Sensor
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Product Overview

ON Semiconductor's range of J-Series SiPM sensors have been used to create high fill-factor, scaleable arrays. The sensors are mounted onto PCB boards with minimal dead space, forming arrays with industry-leading fill factor of up to 90%. The ArrayJ products with connectors can be used to interface with the user's own readout via a mating connector, or to a ON Semiconductor Breakout Board (BOB).
  • Each SiPM sensor in the array has three electrical connections: fast output, standard output and common
  • The substrates (cathodes) of all sensors are summed together to form the common I/O
  • Each individual fast output and standard I/O (anode) are routed to its own output pin


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4mm x 4mm






J-Series SiPM Sensor

MSL 1 - Unlimited

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Technical Documents (2)

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CAD Models and drawings are provided to you on a revocable limited licence for your internal use only but remain the property of the manufacturer who retain all intellectual property rights and ownership. They are provided to assist you in decision making and as design guide but are not guaranteed to be error free, accurate or up to date and is not intended to be taken as advice.
Use of these CAD models and other options provided are downloaded and used entirely at your own risk and by continuing you confirm acceptance of the above.

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Available to manufacturer lead time of 211 days

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